PET / PEN Mold Release Film
Product Description
Mold release film is used in QFN and mini LED packaging processes. This non-stick film facilitates the clean, efficient release of components from their molds, preventing damage and residue. Withstanding high temperatures and harsh conditions, it is crucial in maintaining product quality, reducing material waste, and improving overall production times.
Features
- No Wrinkles: When the mold release film is loaded into the mold, there are no wrinkles in the film.
- No EMC Leakage or Overflow: During the packaging die-casting process, EMC will not leak from the edges or gaps of the mold, avoiding the formation of unnecessary and excess thin film.
- Non-sticky: During the process of opening the mold and separating the mold release film from the package, the film will not cause deformation to the package.
- No Residue: The mold release film will not cause any contamination to the surface of the package.
Application
- Mold release film for the epoxy mold compound (EMC) process of QFN, Mini LED, or Micro LED.
Technical Properties
| Test Item | 5350 | 5370 | 53100 | 53120 | 5350NX | |
|---|---|---|---|---|---|---|
| Material | PET | PET | PET | PET | PEN | |
| Thickness(mm) | 0.05 | 0.07 | 0.10 | 0.12 | 0.05 | |
| Tensile Strength at Break (MPa) | 260 | 260 | 260 | 260 | 260 | |
| Elongation at Break (%) | 140 | 140 | 140 | 140 | 190 | |
| Stress at 5% Elongation (MPa) | 110 | 110 | 110 | 110 | 110 | |
| Shrinkage Rate (%) | MD | 1.3 | 1.3 | 1.3 | 1.3 | 1.3 |
| TD | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | |
| Surface Roughness(um) | Ra | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 |
| Rz | 2.9 | 2.9 | 2.9 | 2.9 | 2.9 | |
| Haze | GU | 4.2 | 4.2 | 4.2 | 4.2 | 4.2 |
