Application of High-temperature PI Adhesive Tape in the PVD Coating Process

Introduction to the PVD Coating Process

Physical Vapor Deposition (PVD) is an advanced surface treatment technology widely used in the semiconductor, optical, and electronics industries. This technology involves the evaporation or sputtering of solid materials in a vacuum environment, which are then deposited on the substrate surface to form a uniform and dense film. The PVD coating process typically involves high-temperature environments to ensure the high quality and good adhesion of the film.

Application Method of High-Temperature PI Tape

In the PVD coating process, high-temperature PI adhesive tape is used to protect specific areas of the glass substrate, particularly the traces and solder bumps after flip chip packaging. The application steps are as follows:

1. Tape Selection: Choose HORAE’s high-temperature PI tape, which has a polyimide (PI) film base and an acrylic adhesive. This tape offers excellent high-temperature resistance and adhesion, suitable for the rigorous conditions of the PVD process.
2. Surface Protection: Before PVD coating, the tape is precisely applied to the protection area of the glass substrate. The adhesive force ensures it does not peel off under high-temperature conditions, effectively protecting the IR coating on the glass surface.
3. High-Temperature Testing: After high-temperature testing (as shown in Figure 1 conditions), the tape maintains good adhesion without contaminating the glass surface. The improved tape leaves no residue after testing (as shown in Figures 2 and 3).
4. Removing the Tape: After PVD coating, the tape is carefully removed to ensure no residue remains on the glass surface, facilitating subsequent processes.

Significant Role of High-Temperature PI Tape in the PVD Process

1. High-Temperature Protection: The high-temperature PI tape remains stable in terms of physical and chemical properties under high temperatures, ensuring effective protection of the substrate.
2. Preventing Contamination: The tape prevents PVD coating materials from depositing in unwanted areas, particularly on the traces and solder bumps after flip chip packaging. This ensures the product’s electrical performance and avoids potential damage from subsequent cleaning processes.
3. Improving Yield: By selecting high-performance heat-resistant PI adhesive tape, the yield of PVD coating can be significantly improved, reducing defects caused by surface contamination or damage, thus lowering production costs.
4. Material Compatibility: The tape is compatible with the IR coating on the glass surface, ensuring no chemical reactions or physical peeling occurs under high temperatures, maintaining the integrity and functionality of the coating.

결론

High-temperature PI tape plays an indispensable role in the PVD coating process. Its outstanding heat resistance, contamination-free characteristics, and excellent adhesion performance ensure the efficiency of the coating process and the high quality of the product. Through continuous formulation optimization, HORAE’s high-temperature PI tape has achieved perfect test results in the rigorous PVD process, providing a reliable solution for semiconductor manufacturing.

Curing performance